Pixel circuit, electro-optical device, and electronic apparatus

ABSTRACT

An electro-optical device formed on a semiconductor substrate, includes: a first transistor controlling a current level according to a voltage between a gate and a source; a second transistor electrically connected between a data line and the gate of the first transistor; a third transistor electrically connected between the gate and a drain of the first transistor; and a light-emitting element emitting light at a luminance according to the current level, in which one of a source and a drain of the second transistor and one of a source and a drain of the third transistor are formed by a common diffusion layer.

This is a Continuation application of U.S. patent application Ser. No.13/669,002, which is a Non-Provisional application filed Nov. 5, 2012which claims priority to Japanese Patent Application No. 2011-249815,filed Nov. 15, 2011. The disclosures of these prior applications arehereby incorporated by reference herein in their entirety.

BACKGROUND

1. Technical Field

The present invention relates to an electro-optical device and anelectronic apparatus useful when a pixel circuit is miniaturized, forexample.

2. Related Art

In recent years, various types of electro-optical devices usinglight-emitting elements such as organic light emitting diodes (below,“OLED”) have been proposed. In such electro-optical devices, pixelcircuits including the above-described light-emitting elements,transistors, and the like corresponding to intersections of scanninglines and data lines are generally configured to be providedcorresponding to the pixels of the image to be displayed. In such aconfiguration, when a data signal of a potential according to thegradation level of the pixels is applied to the gate of the transistor,the transistor supplies current according to the voltage between thegate and the source to the light-emitting element. In this manner, thelight-emitting element emits light with a luminance according to thegradation level.

For such electro-optical devices, there is great demand for reduction ofthe display size and an increase in the high definition of the display.In order to achieve both reduction of the display size and an increasein the high definition of the display, since there is a need tominiaturize the pixel circuit, a technique providing the electro-opticaldevice on a silicon integrated circuit, for example, has also beenproposed (for example, refer to JP-A-2009-288435).

Here, when the pixel circuit is miniaturized, it is necessary to controlthe current supplied to the light-emitting element within a microregion. The current supplied to the light-emitting element is controlledaccording to the voltage between the gate and the source of thetransistor; however, in the micro region, the current supplied to thelight-emitting element changes greatly with respect to slight changes inthe voltage between the gate and the source.

On the other hand, when the pixel circuit is miniaturized, since thecapacitance for holding the voltage between the gate and the source isalso reduced, when an electrical charge is drawn from the capacitance,there is a problem in that, without being able to maintain the voltagebetween the gate and the source, the light-emitting element becomesunable to emit light at a luminance according to the gradation level.

SUMMARY

An advantage of some aspects of the invention is that it provides apixel circuit, an electro-optical device, and an electronic apparatuscapable of supplying current to a light-emitting element with highprecision when the pixel circuit is miniaturized.

According to an aspect of the invention, there is provided a pixelcircuit which is formed on a semiconductor substrate and includes adriving transistor having a first gate, a first drain, and a firstsource, the first transistor controlling a current level according to avoltage between the first gate and the first source; a writingtransistor through which the first gate of the first transistor iselectrically connected to a data line during the writing transistor isin an on-state, the writing transistor having a second gate, a seconddrain, and a second source; a threshold compensation transistor throughwhich the first gate of the first transistor is electrically connectedto the first drain of the first transistor during the thresholdcompensation transistor is in an on-state, the threshold compensationtransistor having a third gate, a third drain, and a third source; and alight-emitting element emitting light at a luminance according to thecurrent level, in which one of the second source and the second drain ofthe writing transistor and one of the third source and the third drainof the threshold compensation transistor are formed by a commondiffusion layer. According to an aspect of the invention, there isprovided a pixel circuit which is formed on a semiconductor substrateand includes a driving transistor driving current according to thevoltage between a gate and a source; a writing transistor electricallyconnected between a data line and a gate of the driving transistor; athreshold compensation transistor electrically connected between thegate and a drain of the driving transistor; a first storage capacitor ofwhich one end is electrically connected to the gate of the drivingtransistor, and which holds a voltage between the gate and the source ofthe driving transistor; and a light-emitting element emitting light at aluminance according to the size of a current supplied from the drivingtransistor, in which one of the source and the drain of the writingtransistor and one of the source and the drain of the thresholdcompensation transistor are formed by a common diffusion layer.

According to the aspect of the invention, since one of the source andthe drain of the writing transistor and one of the source and the drainof the threshold compensation transistor are formed by a commondiffusion layer, in comparison with a case where the writing transistorand the threshold compensation transistor are formed by differentdiffusion layers, it is possible to reduce the transfer (leakagecurrent) of the electrical charge from the first storage capacitorthrough the diffusion layer to the N well formed on the semiconductorsubstrate. In this manner, the changes of the voltage between the gateand the source of the driving transistor caused by the leakage currentare reduced, and the driving transistor is able to supply a current withan accurate magnitude according to the gradation level to thelight-emitting element.

In addition, it is preferable that the above-described pixel circuitfurther include an initialization transistor electrically connectedbetween the potential line to which a predetermined potential issupplied and the light-emitting element.

According to the aspect of the invention, it is possible to suppress theinfluence of the holding voltage of the capacitor having a parasiticcapacitance upon the light-emitting element.

In addition, it is preferable that the above-described pixel circuitfurther include a light-emitting control transistor electricallyconnected between the driving transistor and the light-emitting element.

According to the aspect of the invention, it is possible to control theperiod in which the light-emitting element emits light.

In addition, according to another aspect of the invention, in theelectro-optical device, a plurality of scanning lines extending in afirst direction, a plurality of data lines extending in a seconddirection and a plurality of pixel circuits provided corresponding tointersections of the scanning lines and the data lines are formed on asemiconductor substrate, and each of the plurality of pixel circuits isa pixel circuit according to any one of the first to third aspects.

According to the aspect of the invention, it is possible to reducechanges in the voltage between the gate and the source of the drivingtransistor caused by the leakage current and the driving transistor isable to supply a current with an accurate magnitude according to thegradation level to the light-emitting element.

In addition, it is preferable that the above-described electro-opticaldevice further include a plurality of first signal lines extending inthe first direction, in which the gate of the threshold compensationtransistor is electrically connected to the first signal lines and thegate of the writing transistor is electrically connected to the scanninglines, and, when a straight line in which the distances from thescanning lines and the first signal lines electrically connected to thesame pixel circuit in the plurality of scanning lines and the pluralityof first signal lines are equal is set as a center line, connectionwiring in which the common diffusion layer and the gate of the drivingtransistor are electrically connected is provided between the scanninglines and the first signal lines electrically connected to the samepixel circuit and intersects the center line when viewed from adirection orthogonal to the semiconductor substrate.

According to the aspect of the invention, the gap between the connectionwiring and the first signal lines and the scanning lines is increased,and it is possible to prevent the capacitors between the connectionwiring and the first signal lines or between the connection wiring andthe scanning lines from having a parasitic capacitance. In this manner,the influence of potential fluctuations generated in the scanning lineand the first signal line is prevented from reaching the gate of thedriving transistor through the connection wiring.

Therefore, according to the aspect of the invention, the potential ofthe gate of the driving transistor can be prevented from fluctuating dueto the influence of potential fluctuations generated in the scanninglines and the first signal lines and the driving transistor is able tosupply a current with an accurate magnitude according to the gradationlevel to the light-emitting element.

In addition, it is preferable that, in the above-describedelectro-optical device, each of the common diffusion layer and gate ofthe driving transistor is provided between the scanning lines and thefirst signal lines electrically connected to the same pixel circuit andintersects the center line when viewed from a direction orthogonal tothe semiconductor substrate.

According to the aspect of the invention, since it is possible toprevent the influence of potential fluctuations generated in thescanning line and the first signal line from reaching the gate of thedriving transistor through the connection wiring, the driving transistoris able to supply a current with an accurate magnitude according to thegradation level to the light-emitting element.

In addition, it is preferable that, in the above-describedelectro-optical device, when the minimum value of a gap between theconnection wiring, the gate of the driving transistor, and the commondiffusion layer, and the first signal lines is set as a first gap andthe minimum value of a gap between the connection wiring, the gate ofthe driving transistor, and the common diffusion layer, and the scanninglines is set as a second gap, the first gap and the second gap be equal.

According to the aspect of the invention, since it is possible toprevent the influence of potential fluctuations generated in thescanning line and the first signal line from reaching the gate of thedriving transistor through the connection wiring, the driving transistoris able to supply a current with an accurate magnitude according to thegradation level to the light-emitting element.

In addition, it is preferable that the above-described electro-opticaldevice further include a second storage capacitor of which one end iselectrically connected to the data lines and which holds the potentialof the data lines, and a third storage capacitor of which one end isconnected to the data lines and to which a data signal of a potentialregulating the luminance of the light-emitting element is supplied tothe other end.

According to the aspect of the invention, the data signal of thepotential regulating the luminance of the light-emitting element issupplied to one end of the third storage capacitor. As well as beingconnected to the other end of the third storage capacitor, the datalines are connected to one end of the second storage capacitor.Accordingly, the range of the potential fluctuations of the data linesbecomes a value in which the range of the potential fluctuations of thedata signal is compressed according to the capacitance ratio of thethird storage capacitor with respect to the second storage capacitor.Since the second storage capacitor has a large capacitance, the range ofpotential fluctuations of the data lines is compressed to besufficiently small in comparison with the range of the potentialfluctuations of the data signal. In this manner, even without cutting upthe data signal with fine precision, it is possible to supply currentwith high precision with respect to the light-emitting element.

Here, in addition to the electro-optical device, the invention can beconceived as an electronic apparatus having the electro-optical device.Examples of the electronic apparatus typically include displayapparatuses such as a head mounted display (HMD), or an electronicviewfinder.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a perspective view showing a configuration of anelectro-optical device according to a first embodiment of the invention.

FIG. 2 is a view showing a configuration of the same electro-opticaldevice.

FIG. 3 is a view showing a pixel circuit in the same electro-opticaldevice.

FIG. 4 is a plan view showing a structure of the same electro-opticaldevice.

FIGS. 5A and 5B are partial cross-sectional views showing the structureof the same electro-optical device.

FIG. 6 is a timing chart showing operations of the same electro-opticaldevice.

FIG. 7 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 8 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 9 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 10 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 11 is a diagram showing amplitude compression of a data signal inthe same electro-optical device.

FIG. 12 is a plan view showing a structure of an electro-optical deviceaccording to a comparative example.

FIG. 13 is a partial cross-sectional view showing a structure of anelectro-optical device according to a comparative example.

FIG. 14 is a diagram showing characteristics of a transistor in theelectro-optical device according to the first embodiment of theinvention.

FIG. 15 is a diagram showing the configuration of the electro-opticaldevice according to the second embodiment.

FIG. 16 is a timing chart showing operations of the same electro-opticaldevice.

FIG. 17 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 18 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 19 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 20 is an explanatory diagram of operations of the sameelectro-optical device.

FIG. 21 is a perspective view showing an HMD using the electro-opticaldevice according to the embodiments and the like.

FIG. 22 is a view showing the optical configuration of the HMD.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Below, aspects for embodying the invention will be described withreference to the drawings.

First Embodiment

FIG. 1 is a perspective view showing a configuration of anelectro-optical device 10 according to an embodiment of the invention.

For example, the electro-optical device 10 is a micro display displayingan image in a head mounted display. Detailed description will be givenof the electro-optical device 10 later; however, the device is anorganic EL apparatus in which a plurality of pixel circuits and drivingcircuits or the like driving the pixel circuits are formed on a siliconsubstrate, for example, in which an OLED which is an example of alight-emitting element is used in the pixel circuits.

The electro-optical device 10 is accommodated in an opening in a displayunit or a see-through frame-shaped case 72, and one end of an FPC(Flexible Printed Circuit) substrate 74 is connected thereto. In the FPCsubstrate 74, a control circuit 5 of a semiconductor chip is mountedusing a COF (Chip On Film) technique and a plurality of terminals 76 areprovided and connected to a high-order circuit omitted from thedrawings. Image data is synchronized with a synchronization signal andsupplied from the high-order circuit through the plurality of terminals76. The synchronization signal includes a vertical synchronizationsignal, a horizontal synchronization signal, and a dot clock signal. Inaddition, the image data regulates the gradation level of the pixels ofthe image to be displayed using 8 bits, for example.

The control circuit 5 combines the functions of a power circuit of theelectro-optical device 10 and a data signal output circuit. That is, inaddition to supplying each type of control signal and various types ofpotential generated in accordance with the synchronization signal to theelectro-optical device 10, the control circuit 5 converts the digitalimage data to an analog data signal and performed supply thereof to theelectro-optical device 10.

FIG. 2 is a view showing a configuration of the electro-optical device10 according to the first embodiment. As shown in the drawing, theelectro-optical device 10 is divided broadly into a scanning linedriving circuit 20, a demultiplexer 30, a level shift circuit 40, and adisplay unit 100.

Among these, in the display unit 100, pixel circuits 110 correspondingto the pixels of the image to be displayed are arranged in a matrixshape. In detail, as shown in FIG. 2, in the display unit 100, m rows ofscanning lines 12 are provided to extend in the X direction (firstdirection), and, (3n) columns of data lines 14 grouped in threes areprovided to extend in the Y direction (second direction) and preservethe electrical insulation between each of the scanning lines 12. Then,pixel circuits 110 corresponding to the intersection portions betweenthe m rows of scanning lines 12 and the (3n) columns of data lines 14are provided. For this reason, in the present embodiment, the pixelcircuits 110 are arranged in a matrix shape with m rows vertically×(3n)columns horizontally.

Here, m and n are both natural numbers. In the matrix of the scanninglines 12 and the pixel circuit 110, in order to distinguish the rows,there are cases where the rows are referred to as 1, 2, 3, . . . ,(m-1), and m in order from the top of the drawing. In the same manner,in order to distinguish between the columns of the matrix of the datalines 14 and the pixel circuits 110, there are cases where the columnsare referred to as 1, 2, 3, . . . , (3n-1), and (3n) in order from theleft of the drawing. In addition, when the integer j of 1 or more to nor less is used in order to generalize and explain the groups of thedata lines 14, it signifies that the data lines 14 of the (3j-2) column,the (3j-1) column, and the (3j) column belong to the j-th group countedfrom the left.

Here, three pixel circuits 110 corresponding to the intersections of thescanning lines 12 of the same row and three columns of the data lines 14belonging to the same group respectively correspond to pixels of R(red), G (green), and B (blue), and these three pixels express one dotof the color image to be displayed. That is, in the present embodiment,a color of one dot is configured to be expressed using additive colormixing according to the emitted light of the OLED corresponding to RGB.

In the present embodiment, in each column, potential lines 16 arerespectively provided along the data lines 14. A potential Vorst as areset potential is supplied in common to each potential line 16. Inaddition, a storage capacitor 50 is provided in each column. In detail,one end of the storage capacitor is connected to the data line 14 andthe other end is connected to the potential line 16. For this reason,the storage capacitor 50 functions as a second storage capacitor holdingthe potential of the data line 14.

Here, it is preferable to adopt a configuration in which the storagecapacitor 50 is formed by interposing an insulating body (dielectricbody) with wiring configuring the data lines 14 and wiring configuringthe potential lines 16.

In addition, the storage capacitor 50, is provided on the outside of thedisplay unit 100 in FIG. 2; however, this is only an equivalent circuit,and it may be provided in the inside of the display unit 100 or passingfrom the inside to the outside thereof as a matter of course. Further,although omitted in FIG. 2, the capacitance of the storage capacitor 50is set as Cdt.

Here, the following kind of control signal is supplied by the controlcircuit 5 to the electro-optical device 10. In detail, a control signalCtr for controlling the scanning line driving circuit 20, controlsignals Sel(1), Sel(2), and Sel(3) for controlling the selection withthe demultiplexer 30, control signals /Sel(1), /Sel(2), and /Sel(3)which had a logic inversion relationship with respect to these signals,a negative logic control signal /Gini for controlling the level shiftcircuit 40, and a positive logic control signal Gref are supplied to theelectro-optical device 10. In addition, in practice, the control signalCtr includes a plurality of signals such as a pulse signal or a clocksignal, and an enable signal.

In addition, the data signals Vd(1), Vd(2), . . . , and Vd(n) matchingthe selection timing of the demultiplexer 30 are supplied to theelectro-optical device 10 by the control circuit 5 corresponding to thegroups numbered 1, 2, . . . , and n. Here, the maximum value of thepotential that can be taken by the data signals Vd(1) to Vd(n) is set asVmax and the minimum value is set as Vmin.

The scanning line driving circuit 20 generates scanning signals forscanning the scanning lines 12 in order one row at a time throughout theperiod of the frame in accordance with the control signal Ctr. Here, thescanning signals supplied to the scanning lines 12 of rows numbered 1,2, 3, . . . , (m-1), and m are denoted as Gwr(1), Gwr(2), Gwr(3), . . ., Gwr(m-1), and Gwr(m).

Here, in addition to the scanning signals Gwr(1) to Gwr(m), the scanningline driving circuit 20 generates various types of control signalssynchronized with the scanning signals for each row and performs supplythereof to the display unit 100; however, these are not drawn in FIG. 2.Further, the period of the frame refers to the period necessary for theelectro-optical device 10 to display an image of 1 cut (frame) portion,for example, if the frequency of the orthogonal synchronization signalincluded in the synchronization signal is 120 Hz, the one cycle portionis a period of 8.3 milliseconds.

The demultiplexer 30 is a collection of transmission gates 34 providedfor each column, and supplies data signals in order to the three columnsconfiguring each group.

Here, the input ends of the transmission gates 34 corresponding to thecolumns (3j-2), (3j-1), and (3j) belonging to the j numbered groups aremutually connected in common and respective data signals Vd(j) aresupplied to the common terminals.

The transmission gates 34 provided in columns (3j-2) which are the leftend columns in the j numbered groups are turned on (conduct) when thecontrol signal Sel(1) is the H level (control signal /Sel(1) is the Llevel). Similarly, the transmission gates 34 provided in columns (3j-1)which are the middle columns in the j numbered groups are turned on whenthe control signal Sel(2) is the H level (when the control signal/Sel(2) is the L level) and the transmission gates 34 provided incolumns (3j) which are the right end columns in the j numbered groupsare turned on when the control signal Sel(3) is the H level (when thecontrol signal /Sel(3) is the L level).

The level shift circuit 40 has a set of the storage capacitor 44, the Pchannel MOS type transistor 45, and the N channel MOS type transistor 43for each column, and shifts the potential of the data signals outputfrom the output end of the transmission gate 34 of each column. Here,one end of the storage capacitor 44 is connected to a data line 14 ofthe corresponding column and the drain node of the transistor 45 whilethe other end of the storage capacitor 44 is connected to the output endof the transmission gate 34 and the drain node of the transistor 43. Forthis reason, the storage capacitor 44 functions as a third storagecapacitor of which one end is connected to the data lines 14 and datasignals are supplied to the other end. Although omitted from FIG. 2, thecapacitance of the storage capacitor 44 is set to Crf1.

The source nodes of the transistors 45 of each column are connected incommon across each column to a power supply line 61 supplying thepotential Vini as the initial potential, and the control signal /Gini issupplied in common across each column to the gate nodes. For thisreason, the transistor 45 is configured so as to electrically connectthe data lines 14 and the power supply lines 61 when the control signal/Gini is the L level and to perform electrical disconnection when thecontrol signal /Gini is the H level.

In addition, the source nodes of the transistors 43 of each column areconnected in common across each column to the power supply line 62supplying the potential Vref as a predetermined potential, and thecontrol signal Gref is supplied in common across each column to the gatenodes. For this reason, the transistor 43 is configured so as toelectrically connect the node h which is the other end of the storagecapacitor 44 and the power supply lines 62 when the control signal Grefis the H level and to perform electrical disconnection when the controlsignal Gref is the L level.

In the present embodiment, although divided into the scanning linedriving circuit 20, the demultiplexer 30 and the level shift circuit 40for convenience, these may be conceived together as driving circuitsdriving the pixel circuits 110.

Description will be given of the pixel circuits 110 with reference toFIG. 3. Since each pixel circuit 110 has the same configuration as theothers electrically, here, description will be given taking the pixelcircuit 110 of the i row (3j-2) column positioned at the (3j-2)-thcolumn of the left end side in the groups numbered j, which is an i-throw, as an example. In addition, i is a reference sign of a casegenerally showing rows in which the pixel circuits 110 are arranged, andis an integer of 1 or more and m or less.

As shown in FIG. 3, the pixel circuit 110 includes P channel MOS typetransistors 121 to 125, an OLED 130, and a storage capacitor 132. Thescanning signal Gwr(i), the control signals Gel(i), Gcmp(i), andGorst(i) are supplied to the pixel circuits 110. Here, the scanningsignal Gwr(i), and the control signals Gel(i), Gcmp(i), and Gorst(i) aresupplied by the scanning line driving circuit 20 corresponding to therespective i rows. For this reason, the scanning signal Gwr(i), and thecontrol signals Gel(i), Gcmp(i), and Gorst(i) are also supplied incommon to pixel circuits of columns other than the (3j-2) column beingfocused on if in the i row.

In the transistor 122, the gate node is connected to the scanning lines12 of the i row, and one of the drain or the source node is respectivelyconnected to the gate node g in the transistor 121, one end of thestorage capacitor 132, and one of the source or the drain of thetransistor 123. In addition, in the transistor 122, the other of thedrain or the source node is connected to the data lines 14 of the (3j-2)column. That is, the transistor 122 is electrically connected betweenthe gate node g of the transistor 121 and the data lines 14, controlsthe electrical connection between the gate node g of the transistor 121and the data lines 14, and functions as a writing transistor. Here, thegate node of transistor 121 is denoted as g in order to be distinguishedfrom other nodes.

In the transistor 121, the source node is connected to the power supplyline 116, and the drain node is respectively connected to the other ofthe source or the drain node of the transistor 123 and the source nodeof the transistor 124. Here, the potential Vel which is the high orderside of the power in the pixel circuit 110 is supplied to the powersupply line 116. The transistor 121 functions as a driving transistordriving current according to the voltage between the gate node and thesource node of the transistor 121.

The control signal Gcmp(i) is supplied to the gate node of thetransistor 123. The transistor 123 controls the electrical connectionbetween the source node and the gate node g of the transistor 121 andfunctions as a threshold compensation transistor.

The control signal Gel(i) is supplied to the gate node of the transistor124 and the drain node is respectively connected to the source node ofthe transistor 125 and the anode of the OLED 130. In other words, thetransistor 124 controls the electrical connection between the drain nodeof the transistor 121 and the anode of the OLED 130 and functions as alight-emitting control transistor.

The control signal Gorst(i) corresponding to the i row is supplied tothe gate node of the transistor 125, and the drain node is connected tothe potential line 16 of (3j-2) column and preserved at the potentialVorst. The transistor 125 functions as an initialization transistorcontrolling the electrical connection between the potential line 16 andthe anode of the OLED 130.

The other end of the storage capacitor 132 is connected to the powersupply line 116. For this reason, the storage capacitor 132 functions asa first storage capacitor holding the voltage between the gate and thesource of the transistor 121. In the following, the capacitance of thestorage capacitor 132 is denoted as Cpix.

The capacitance Cdt of the storage capacitor 50, the capacitance Crf1 ofthe storage capacitor 44, and the capacitance Cpix of the storagecapacitor 132 are set so thatCdt>Crf1>>CpixThat is, Cdt is set to be greater than Crf1, and Cpix is set to besufficiently smaller than Cdt and Crf1.

Here, although details will be given below, the storage capacitor 132 inthe present embodiment is formed by interposing an insulating layer withmutually different wiring layers; however, a parasitic capacitance onthe gate node g of the transistor 121 may be used as the storagecapacitor 132.

Since the electro-optical device 10 in the present embodiment is formedon a silicon substrate, the substrate potential of the transistors 121to 125 is set to the potential Vel.

The anode of the OLED 130 is a pixel electrode provided individually foreach pixel circuit 110. In contrast, the cathode of the OLED 130 is acommon electrode 118 common across all of the pixel circuits 110, andpreserved at the potential Vct which is the low order side of the powerin the pixel circuits 110.

In the above-described silicon substrate, the OLED 130 is an element inwhich a white organic EL layer is interposed by an anode and a cathodehaving light permeability. Here, on the output side (cathode side) ofthe OLED 130, a color filter corresponding to any one of RGB issuperimposed.

In such an OLED 130, when the current flows from the anode to thecathode, the holes injected from the anode and the electrons injectedfrom the cathode are recombined in the organic EL layer, excitons areproduced, and white light is generated. The white light generated atthis time passes through a cathode of the opposite side to the siliconsubstrate (anode), is colored by the color filter, and configured to bevisible on the observation side.

Description will be given of the structure of the pixel circuits 110with reference to FIG. 4 and FIGS. 5A and 5B. Since each pixel circuit110 is configured in the same manner, in FIG. 4 and FIGS. 5A and 5B,description is given taking the pixel circuit 110 of i row (3j-2) columnas an example. FIG. 4 is a plan view showing a configuration of thepixel circuit 110 of i row (3j-2) column. In addition, FIG. 5A is apartial cross-sectional view cut away along line VA-VA in FIG. 4, andFIG. 5B is a partial cross-sectional view cut away along line VB-VB inFIG. 4.

In addition, FIG. 4 shows the wiring structure of a case where the pixelcircuit 110 of the transmission structure is a plan view from theobservation side; however, for simplicity, the structural body formedafter the second wiring layer to be described later has been omitted.Similarly, in FIGS. 5A and 5B, for simplicity, the structural bodyformed after the third interlayer insulating layer L3 to be describedlater has been omitted.

Here, in each of the above drawings, there are cases where the scalesare made to be different in order to set each layer, each member, eachregion, and the like to a visible size.

As shown in FIGS. 5A and 5B, each element configuring the pixel circuit110 is formed on a silicon substrate 150. In the present embodiment, a Ptype semiconductor substrate is used as the silicon substrate 150.

On the silicon substrate 150, N wells 160 are formed across almost theentire surface. Here, in FIG. 4, when shown in plan view, in order toenable the regions where the transistors 121 to 125 are provided to beeasily grasped, only the regions where the transistors 121 to 125 areprovided and the vicinity thereof in the N wells 160 are shown withhatching.

A potential Vel is supplied to the N wells 160 through an N typediffusion layer (not shown). For this reason, the substrate potential ofthe transistors 121 to 125 is the potential Vel.

As shown in FIG. 4 and FIGS. 5A and 5B, by doping ions in the surface ofthe N wells 160, a plurality of P type diffusion layers are formed.Specifically, on the surface of the N wells 160, 8 P type diffusionlayers P1 to P8 are formed for each pixel circuit 110.

These P type diffusion layers P1 to P8 function as sources or drains ofthe transistors 121 to 125.

As shown in FIGS. 5A and 5B, on the surfaces of the N wells 160 and theP type diffusion layers P1 to P8, a gate insulating layer L0 and gateelectrodes G1 to G5 are formed by patterning.

These gate electrodes G1 to G5 function as gates of each of thetransistors 121 to 125.

As shown in FIG. 4 and FIGS. 5A and 5B, the transistor 121 is configuredto have a gate electrode G1, a P type diffusion layer P7 and a P typediffusion layer P8. Among these, the P type diffusion layer P8 functionsas a source of the transistor 121, and the P type diffusion layer P7functions as a drain of the transistor 121.

In addition, the transistor 122 is configured to have a gate electrodeG2, a P type diffusion layer P1 and a P type diffusion layer P2. Amongthese, the P type diffusion layer P2 functions as one of a source or adrain of the transistor 122, and the P type diffusion layer P1 functionsas the other of the source or the drain of the transistor 122.

The transistor 123 is configured to have a gate electrode G3, a P typediffusion layer P2 and a P type diffusion layer P3. Among these, the Ptype diffusion layer P2 functions as one of a source or a drain of thetransistor 123 and the P type diffusion layer P3 functions as the otherof the source or the drain of the transistor 123.

That is, the P type diffusion layer P2 is a common diffusion layer whichfunctions as one of the source or the drain of the transistor 122, andfunctions as one of the source or the drain of the transistor 123.

The transistor 124 is configured to have a gate electrode G4, a P typediffusion layer P3 and a P type diffusion layer P4. Among these, the Ptype diffusion layer P3 functions as a source of the transistor 124, andthe P type diffusion layer P4 functions as a drain of the transistor124.

The transistor 125 is configured to have a gate electrode G5, a P typediffusion layer P5 and a P type diffusion layer P6. Among these, the Ptype diffusion layer P5 functions as a source of the transistor 125, andthe P type diffusion layer P6 functions as a drain of the transistor125.

As shown in FIGS. 5A and 5B, a first interlayer insulating layer L1 isformed so as to cover the gate electrodes G1 to G5 and the gateinsulating layer L0.

By patterning a wiring layer with conductivity of aluminum or the likeon the surface of the first interlayer insulating layer L1, scanninglines 12, power supply lines 116, and signal lines 141 to 143 arerespectively formed and relay nodes N1 to N5 are respectively formed foreach pixel circuit 110. Here, there are cases where these wiring layersformed on the surface of the first interlayer insulating layer L1 arecollectively referred to as first wiring layers.

As shown in FIG. 4 and FIGS. 5A and 5B, the relay node N1 is connectedto the P type diffusion layer P1 through a contact hole Ha1 passingthrough the first interlayer insulating layer L1. In other words, therelay node N1 is equivalent to the other of the source node or the drainnode of the transistor 122. Here, in FIG. 4, the contact holes are shownas portions having a square mark with a cross inside at portions wheredifferent types of wiring layers are overlapped.

The relay node N2 is connected to the P type diffusion layer P2 throughthe contact hole Ha2 and connected to the gate electrode G1 through thecontact hole Ha11. In other words, the relay node N2 is equivalent tothe gate node g of the transistor 121, and equivalent to one of thesource node or the drain node of the transistor 122 and one of thesource or drain node of the transistor 123. Here, the wiring formed ofthe contact hole Ha2, the relay node N2, and the contact hole Ha11functions as connection wiring electrically connecting the P typediffusion layer P2 and the gate node G1.

The relay node N3 is connected to the P type diffusion layer P3 throughthe contact hole Ha3 and connected to the P type diffusion layer P7through the contact hole Ha7. In other words, the relay node N3 isequivalent to the drain node of the transistor 121, and equivalent tothe other of the source or the drain node of the transistor 123 and thesource node of the transistor 124.

The relay node N4 is connected to the P type diffusion layer P4 throughthe contact hole Ha4 and connected to the P type diffusion layer P5through the contact hole Ha5. In other words, the relay node N4 isequivalent to the drain node of the transistor 124, and equivalent tothe source node of the transistor 125.

The relay node N5 is connected to the P type diffusion layer P6 throughthe contact hole Ha6. In other words, the relay node N5 is equivalent tothe drain node of the transistor 125.

The signal line 143 is connected to the gate electrode G3 through acontact hole Ha13. Here, a control signal Gcmp(i) corresponding to thepixel circuit 110 is supplied to the signal line 143. That is, thesignal line 143 functions as a first signal line electrically connectedto the gate of the transistor 123.

In addition, the signal line 141 is connected to the gate electrode G4through a contact hole Ha14. A control signal Gel(i) corresponding tothe pixel circuit 110 is supplied to the signal line 141.

The signal line 142 is connected to the gate electrode G5 through acontact hole Ha15. A control signal Gorst(i) corresponding to the pixelcircuit 110 is supplied to the signal line 142.

The scanning line 12 is connected to the gate electrode G2 through acontact hole Ha12. The power supply line 116 is connected to the P typediffusion layer P8 through a contact hole Ha8.

Here, the contact holes Ha2 to Ha8 and the contact holes Ha11 to Ha15are contact holes passing through the first interlayer insulating layerL1.

As shown in FIG. 4, when shown in plan view, the P type diffusion layerP2, the gate node G1, and the connection wiring are provided between thesignal lines 143 and the scanning lines 12 at positions which do notoverlap with the signal lines 143 or the scanning lines 12.

Here, in FIG. 4, a straight line which is an equal distance from thesignal lines 143 and the scanning lines 12 is referred to as center lineMid. When shown in plan view, the P type diffusion layer P2, the gatenode G1, and the connection wiring are provided at positionsintersecting with the center line Mid. In more detail, when seen in planview, the contact hole Ha2, the relay node N2, and the contact hole Ha11configuring the connection wiring are all provided at positionsintersecting with the center line Mid.

In this manner, by providing the P type diffusion layer P2, the gatenode G1, and the connection wiring at positions so as to intersect withthe center line Mid, the gap between the P type diffusion layer P2, thegate node G1, and the connection wiring, and the scanning lines 12 andthe signal lines 143 is increased, whereby a parasitic capacitance onthe capacitance therebetween (in particular, between the relay node N2and the scanning lines 12 and between the relay node N2 and the signallines 143, formed from the same layer) can be prevented.

In this manner, the influence of potential fluctuations generated at thescanning lines 12 and the signal lines 143 on the potential of the gatenode g can be reduced, and the transistor 121 can accurately supplycurrent according to the gradation level with respect to the OLED 130.

In the present embodiment, as shown in FIG. 4, the central portion ofthe vertical direction of the P type diffusion layer P2, the centralportion of the vertical direction of the gate node G1, and the centralportion of the vertical direction of the connection wiring are arrangedso as to overlap with the center line Mid. That is, when the minimumvalue of the gap between the P type diffusion layer P2, the gate nodeG1, and the connection wiring, and the signal lines 143 is set to thefirst gap Δy₁, and the minimum value of the gap between the P typediffusion layer P2, the gate node G1, and the connection wiring, and thescanning lines 12 is set to the second gap Δy₂, the P type diffusionlayer P2, the gate node G1, and the connection wiring are arranged sothat the first gap Δy₁ and the second gap Δy₂ become equal.

As shown in FIGS. 5A and 5B, the second interlayer insulating layer L2is formed so as to cover the first wiring layer and the first interlayerinsulating layer L1.

By patterning a conductive wiring layer of aluminum or the like on thesurface of the second interlayer insulating layer L2, the data lines 14and the potential lines 16 are respectively formed and, for each pixelcircuit 110, the relay node N11 and the electrode 132 a are respectivelyformed. Although omitted from the drawings, the electrode 132 a and thepower supply line 116 are electrically connected and a potential Vel issupplied to the electrode 132 a. Here, by interposing the secondinterlayer insulating layer L2 between the electrode 132 a and the gateelectrode G1, the storage capacitor 132 is formed.

In addition, there are cases where the wiring layers formed at thesurface of the second interlayer insulating layer L2 are collectivelyreferred to as the second wiring layer.

Here, in the PN bond between the P type diffusion layer and the N wells160, the potential of the P type diffusion layer is set to a state(reverse bias state) lower than the potential of the N wells 160.

However, although the charge accumulated by the storage capacitor 132 isslight, there is a leak to the N wells 160 through the connection wiringand the P type diffusion layer P2. In a case where the transfer of thischarge, that is, the leakage current is large, the storage capacitor 132becomes unable to maintain the voltage between the gate and source ofthe transistor 121. Therefore, in order for the transistor 121 to supplyan accurate current according to the gradation level to the OLED 130, itis necessary to make the leakage current as small as possible.

The size of the leakage current becomes larger according to the contactarea of the P type diffusion layer and the N wells 160. Thus, in thepixel circuit 110 according to the present embodiment, one of the sourceor the drain of the transistor 122 and one of the source or the drain ofthe transistor 123 are formed by a common diffusion layer (P typediffusion layer P2). In this manner, the pixel circuit 110 according tothe present embodiment can reduce the leakage current in comparison witha pixel circuit in which the transistor 122 and the transistor 123 areformed by separate diffusion layers. That is, the pixel circuit 110according to the present embodiment can keep the deterioration of thedisplay quality caused by the leakage current to a minimum.

As shown in FIG. 4, the relay node N11 is connected to the relay node N4through the contact hole Hb2.

The data lines 14 are connected to the relay node N1 through the contacthole Hb1. For this reason, the data lines 14 are connected to the P typediffusion layer P1 through the relay node N1 (that is, the other of thesource or the drain of the transistor 122).

The potential line 16 is connected to the relay node N5 through thecontact hole Hb3. For this reason, the potential line 16 is connected tothe P type diffusion layer P6 (that is, the drain of the transistor 125)through the relay node N5.

In addition, the contact holes Hb1 to Hb3 are contact holes passingthough the second interlayer insulating layer L2.

As shown in FIGS. 5A and 5B, the third interlayer insulating layer L3 isformed so as to cover the second wiring layer and the second interlayerinsulating layer L2.

In the electro-optical device 10, the structure after the thirdinterlayer insulating layer L3 has been omitted from the drawings;however, anodes of the OLED 130 are formed on the third interlayerinsulating layer L3 by patterning a wiring layer having conductivity ofaluminum, ITO (Indium Tin Oxide), or the like. The anodes of the OLED130 are individual pixel electrodes for each pixel circuit 110, and areconnected to the relay node N11 through contact holes passing throughthe third interlayer insulating layer L3. That is, the anodes of theOLED 130 are connected to the P type diffusion layer P4 (in other words,the drain of the transistor 124) and the P type diffusion layer P5 (inother words, the source of the transistor 125) through the relay nodeN11 and the relay node N4.

In addition, although omitted from the drawings, on the anodes of OLED130, a light-emitting layer formed of an organic EL material divided foreach pixel circuit 110 is laminated. Here, a cathode (common electrode118) which is a common transparent electrode is provided across all ofthe plurality of pixel circuits 110 on the light-emitting layer.

That is, the OLED 130 interposes the light-emitting layer between theanode and the cathode opposite to each other, and emits light with aluminance according to the current flowing toward the common electrode118 from the anode. In the light emitted from the OLED 130, the light inthe direction opposite (that is, the upward direction in FIGS. 5A and5B) to the silicon substrate 150 is visible to an observer as an image(top emission structure).

In addition to this, a sealing material or the like for sealing thelight-emitting layer from the atmosphere is provided; however,description thereof is omitted.

Operation of the First Embodiment

Description will be given of the operation of the electro-optical device10 with reference to FIG. 6. FIG. 6 is a timing chart for illustratingoperations of each portion in the electro-optical device 10.

As shown in the drawing, the scanning signals Gwr(1) to Gwr(m) aresequentially switched to the L level and, in the period of one frame, 1to m rows of scanning lines 12 are scanned in order for each singlehorizontal scanning period (H).

The operation in the single horizontal scanning period (H) is commonacross the pixel circuits 110 of each row. In the following, descriptionwill be given of the operation in a scanning period in which an i-th rowis horizontally scanned with particular focus on the pixel circuit 110of the i row (3j-2) column.

In the present embodiment, when classifying the scanning periods of thei-th row, in FIG. 6, the periods are divided into an initializationperiod shown by (b), a compensation period shown by (c), and a writingperiod shown by (d). Here, after the writing period of (d), after apause, a light-emitting period shown by (a) is started, and the scanningperiod of the i-th row is reached again after the passing of the periodof one frame. For this reason, regarding the chronological order, acycle of (light-emitting period)->initialization period->compensationperiod->writing period->(light-emitting period) is repeated.

Here, in FIG. 6, each of the scanning signal Gwr(i-1), the controlsignals Gel(i-1), Gcmp(i-1) and Gorst(i-1) corresponding to the (i-1)-throw one row before the i row forms a waveform which is earlier than eachof the scanning signal Gwr(i), and the control signals Gel(i), Gcmp(i)and Gorst(i) corresponding to the i row by a single horizontal scanningperiod (H) only.

Light-Emitting Period

For convenience of explanation, description will be given from thelight-emitting period which is a prerequisite for the initializationperiod. As shown in FIG. 6, in the light-emitting period of the i-throw, the scanning signal Gwr(i) is the H level and the control signalGel(i) is the L level. In addition, among the control signals Gel(i),Gcmp(i), and Gorst(i) which are logic signals, the control signal Gel(i)is the L level, and the control signals Gcmp(i) and Gorst(i) are the Hlevel.

For this reason, in the pixel circuits 110 of the i row (3j-2) column asshown in FIG. 7, the transistor 124 is turned on while the transistors122, 123, and 125 are turned off. Therefore, the transistor 121 suppliesa current Ids according to the voltage Vgs between the gate and thesource to the OLED 130. As will be described later, the Vgs voltage inthe light-emitting period in the present embodiment is a valuelevel-shifted according to the potential of the data signals from thethreshold voltage of the transistor 121. For this reason, in the OLED130, the current according to the gradation level is supplied in a statewhere the threshold voltage of the transistor 121 is compensated.

In addition, since the light-emitting period of the i-th row is a periodin which horizontal scanning of other than the i row is performed, thepotential of the data lines 14 is appropriately changed. However, in thepixel circuit 110 of the i-th row, since the transistor 122 is turnedoff, here, potential changes of the data lines 14 are not considered.

In addition, in FIG. 7, the path which is important in the descriptionof the operation is shown with a bold line (the same applies in FIGS. 8to 10, and FIGS. 17 to 20 below).

Initialization Period

Next, when the scanning period of the i-th row is reached, first, theinitialization period of (b) is started as the first period. In theinitialization period, in comparison with the light-emitting period, thecontrol signal Gel(i) is changed to the H level and the control signalGorst(i) is changed to the L level, respectively.

For this reason, as shown in FIG. 8, in the pixel circuit 110 of the irow (3j-2) column, the transistor 124 is turned off and the transistor125 is turned on. In this manner, the path of the current supplied tothe OLED 130 is interrupted and the anodes of the OLED 130 are reset tothe potential Vorst.

Since the OLED 130 has a configuration in which the organic EL layer isinterposed by the anode and the cathode as described above, as shown bya broken line in the drawing, a capacitor Coled has a parasiticcapacitance in parallel between the anode and the cathode. When thecurrent was flowing in OLED 130 in the light-emitting period, thevoltages of both ends between the anode and the cathode of the OLED 130are held by the capacitor Coled; however, the held voltage is reset byturning on the transistor 125. For this reason, in the presentembodiment, when the current flows again to the OLED 130 in thesubsequent light-emitting period, it is not easily affected by theinfluence of the voltage held by the capacitor Coled.

In detail, for example, when a high luminance display state is changedto a low luminance display state, if the configuration is one which isnot reset, since a high voltage of the time when the luminance was high(a large current was flowing) is held, next, an excessive current ismade to flow when trying to make a small current flow and it becomesimpossible to obtain the low luminance display state. In contrast, inthe present embodiment, since the potential of the anode of the OLED 130is reset by turning the transistor 125 on, the reproducibility of thelow luminance side can be improved.

In this embodiment, regarding the potential Vorst, the differencebetween the potential Vorst and the potential Vct of the commonelectrode 118 is set so as to fall below the light-emitting thresholdvoltage of the OLED 130. For this reason, in the initialization period(the compensation period and writing period described next), the OLED130 is in an off (non-light-emitting) state.

On the other hand, in the initialization period, since the controlsignal /Gini is the L level and the Control signal Gref is the H level,the transistors 45 and 43 as shown in FIG. 8 are respectively turned onin the level shift circuit 40. For this reason, the data line 14 whichis one end of the storage capacitor 44 is initialized to the potentialVini and the node h which is the other end of the storage capacitor 44is initialized to the potential Vref, respectively.

Regarding the potential Vini in the present embodiment, (Vel−Vini) isset to be larger than the threshold voltage |Vth| of the transistor 121.In addition, since the transistor 121 is a P channel type, the thresholdvoltage Vth based on the potential of the source node is negative. Here,in order to prevent confusion in the description of the relationshipbetween high and low, the threshold voltage is set to be expressed bythe absolute value |Vth| and regulated by magnitude correlation.

In addition, with respect to the potential which can be taken by thedata signals Vd(1) to Vd(n), the potential Vref in the presentembodiment is set to a value such that the potential of the node h inthe subsequent writing period is increased, for example, set to be lowerthan the minimum value Vmin.

Compensation Period

In the scanning period of the i-th row, next, the compensation period of(c) is the second period. In the compensation period, in comparison withthe initialization period, the scanning signal Gwr(i) and the controlsignal Gcmp(i) are the L level. Meanwhile, in the compensation period,the control signal /Gini is the H level in a state where the controlsignal Gref is maintained at the H level.

For this reason, as shown in FIG. 9, in the level shift circuit 40, thenode h is fixed at the potential Vref by turning off the transistor 45in a state where the transistor 43 is turned on. Meanwhile, since thegate node g is electrically connected to the data lines 14 by turning onthe transistor 122 in the pixel circuit 110 of the i row (3j-2) column,the gate node g becomes the potential Vini at the start of thecompensation period.

Since the transistor 123 is turned on in the compensation period, thetransistor 121 becomes a diode connection. For this reason, the draincurrent flows in the transistor 121 and charges the gate node g and thedata lines 14. In detail, the current flows in a path of the powersupply line 116->the transistor 121->transistor 123->the transistor122->the data line 14 of the (3j-2)-th column. For this reason, the datalines 14 and the gate node g which are in a mutually connected state dueto the turning on of the transistor 121 are increased from the potentialVini.

However, since the current flowing in the above path flows less easilyas the gate node g approaches the potential (Vel−|Vth|), the data line14 and the gate node g are saturated by the potential (Vel−|Vth|) untilthe end of the compensation period is reached. Accordingly, the storagecapacitor 132 holds the threshold voltage |Vth| of the transistor 121until the end of the compensation period is reached.

Writing Period

After the initialization period, the writing period of (d) as the thirdperiod is reached. In the writing period, since the control signalGcmp(i) becomes the H level, the diode connection of the transistor 121is canceled, while since the control signal Gref becomes the L level,the transistor 43 is turned off. For this reason, the path from the dataline 14 of the (3j-2) column to the gate node g in the pixel circuit 110of the i row (3j-2) column is in a floating state, but the potential inthe path is maintained at (Vel−|Vth|) by the storage capacitors 50 and132.

For a j numbered group, the control circuit 5 in the writing period ofthe i row switches the data signals Vd(j) in order to a potentialaccording to the gradation level of pixels of the i row (3j-2) column,the i row (3j-1) column, and the i row (3j) column. Meanwhile, thecontrol circuit 5 sets the control signals Sel(1), Sel(2), and Sel(3) inorder exclusively to the H level in accordance with the switching of thepotential of the data signal. The control circuit 5 has been omitted inFIG. 6; however, output is also performed for the control signals/Sel(1), /Sel(2), and /Sel(3) which have an inverse logic relationshipwith the control signals Sel(1), Sel(2), and Sel(3). In this manner, inthe demultiplexer 30, the transmission gates 34 in each group are turnedon in order of the left end column, the center column, and the right endcolumn, respectively.

Here, when the transmission gate 34 of the left end column is turned onby the control signals Sel(1), and /Sel(1), as shown in FIG. 10, thenode h which is the other end of the storage capacitor 44 is changedfrom the potential Vref fixed in the initialization period and thecompensation period to the potential of the data signal Vd(j), that is,to a potential according to the gradation level of pixels of the i row(3j-2) column. The potential change amount of the node h at this time isset as ΔV and the potential after the change is set to be expressed as(Vref+ΔV).

Meanwhile, since the gate node g is connected to one end of the storagecapacitor 44 through the data lines 14, it has a value (Vel−|Vth|+k1·ΔV)shifted upwards from the potential (Vel−|Vth|) in the compensationperiod by a value in which the potential change amount ΔV of the node his multiplied by the capacitance ratio k1 only. At this time, thevoltage Vgs of the transistor 121 becomes a value (|Vth|−k1·ΔV) in whichthe shifting amount of the increased potential of the gate node g onlyis subtracted from the threshold voltage |Vth|.

Here, the capacitance ratio k1 is Crf1/(Cdt+Crf1). Strictly speaking,the capacitance Cpix of the storage capacitor 132 must also beconsidered; however, since the capacitance Cpix is set so as to becomesufficiently small in comparison with the capacities Crf1 and Cdt, ithas been ignored.

FIG. 11 is a view showing the relationship between the potential of thedata signal and the potential of the gate node g in the writing period.The data signal supplied from the control circuit 5 can take a potentialrange of from the minimum value Vmin to the maximum value Vmax accordingto the gradation level of the pixels as described above. In the presentembodiment, the data signals are not written directly to the gate nodeg, but are level-shifted as shown in the drawing and written to the gatenode g.

At this time, the potential range ΔVgate of the gate node g iscompressed to a value in which the potential range ΔVdata (=Vmax−Vmin)of the data signal is multiplied by the capacitance ratio k1. Forexample, when the capacities of the storage capacitors 44 and 50 are setso that Crf1:Cdt=1:9, it is possible to compress the potential rangeΔVgate of the gate node g to 1/10 of the potential range ΔVdata of thedata signal.

In addition, regarding in which direction and to what extent thepotential range ΔVgate of the gate node g is shifted with respect to thepotential range ΔVdata of the data signal, determination can be madewith the potential Vp (Vel−|Vth|), and Vref. This is because thepotential range ΔVdata of the data signal is compressed by thecapacitance ratio k1 based on the potential Vref and one in which thecompression range is shifted based on the potential Vp becomes thepotential range ΔVgate of the gate node g.

In the writing period of such an i-th row, a potential (Vel−|Vth|+k1·ΔV)shifted from a potential (Vel−|Vth|) in the compensation period by anamount in which the potential change amount ΔV of the node h ismultiplied by the capacitance ratio k1 is written to the gate node g ofthe pixel circuit 110 of the i-th row.

Eventually, the scanning signal Gwr(i) becomes the H level and thetransistor 122 is turned off. In this manner, the writing period isfinished and the potential of the gate node g is confirmed at theshifted value.

Light-Emitting Period

After the writing period of the i-th row is finished, the light-emittingperiod is reached during the single horizontal scanning period. In thislight-emitting period, since the control signal Gel(i) as describedabove becomes the L level, the transistors 124 in the pixel circuits 110of the i row (3j-2) columns are turned on. Since the voltage Vgs betweenthe gate and the source is (|Vth|−k1·ΔV), as shown in the previous FIG.7, the current according to the gradation level is supplied to the OLED130 in a state where the threshold voltage of the transistor 121 iscompensated.

Such an operation is performed in parallel in terms of time in thescanning period of the i row and the also in the other pixel circuits110 of the i-th row other than the pixel circuits 110 of the (3j-2)-thcolumn. In addition, such an operation of the i-th row is in practiceperformed in the order of 1, 2, 3, . . . , (m-1), and m-th row in theperiod of one frame, and is repeated for each frame.

Effect of the First Embodiment

In a case where the electro-optical device is provided on a siliconintegrated circuit and the pixel circuit is miniaturized, it is notpossible to increase the capacitance Cpix of the storage capacitor 132provided in the pixel circuit 110. In particular, the present embodimentdetermines the potential of the gate node g in the writing period basedon the capacitance Cdt of the storage capacitor 50 and the capacitanceCrf1 of the storage capacitor 44. Then, in the subsequent light-emittingperiod, the potential of the gate node g is maintained by the storagecapacitor 132. In other words, since the storage capacitor 132 isnothing more than one for maintaining the potential of the gate node g,the capacitance Cpix of the storage capacitor 132 is set to be madesmaller.

However, in a case where the leakage current flowing from the storagecapacitor 132 to the N well 160 is large, the storage capacitor 132cannot maintain the potential of the gate node g and current of anaccurate magnitude according to the gradation level is not supplied tothe OLED 130. In particular, in a case where the capacitance Cpix of thestorage capacitor 132 is small as in the present embodiment, theinfluence of the leakage current with respect to the potential of thegate node g is large. Thus, the size of the leakage current is a valueaccording to the contact area of the P type diffusion layer P2 and the Nwells 160.

In the present embodiment, by providing a P type diffusion layer P2which is a common diffusion layer, the leakage current is prevented frombecoming large, and it is possible for the transistor 121 to supply acurrent of an accurate magnitude according to the gradation level withrespect to the OLED 130.

Here, in order to explain that the configuration of the pixel circuits110 according to the present embodiment has an effect of reducing thesize of the leakage current, description will be given of aconfiguration of a pixel circuit 110 a according to a comparativeexample.

FIG. 12 is a plan view showing the configuration of the pixel circuit110 a according to the comparative example, and FIG. 13 is a partialcross-sectional view cut away at the line XIII-XIII in FIG. 12. As shownin FIG. 12, in the pixel circuit 110 a, one of the source or the drainof the transistor 122 is formed by the P type diffusion layer P2 a andone of the source or the drain of the transistor 123 is formed by the Ptype diffusion layer P2 b. In such a case, the charge held by thestorage capacitor 132 leaks from both of the P type diffusion layer P2 aand the P type diffusion layer P2 b through the relay node N2 a.

In contrast, in the present embodiment, one of the source or the drainof the transistor 122 and one of the source or the drain of thetransistor 123 are formed by a P type diffusion layer P2 which is acommon diffusion layer. That is, the contact area between the P-typediffusion layer P2 and the N wells 160 according to the presentembodiment is approximately half in comparison with the sum of thecontact area of the P-type diffusion layer P2 a and the N wells 160 andthe contact area of the P-type diffusion layer P2 b and the N wells 160in the comparative example. Therefore, the leakage current generated ina pixel circuit 110 according to the present embodiment can besuppressed to a size of approximately half of the leakage currentgenerated in the pixel circuit 110 a according to the comparativeexample.

In this manner, since it is possible to reduce the leakage currentflowing from the storage capacitor 132 to the N wells 160 in the pixelcircuit 110 according to the present embodiment, it is possible to keepthe deterioration of the display quality caused by the leakage currentto a minimum.

Here, in the present embodiment, since one of the source or the drain ofthe transistor 122 and one of the source or the drain of the transistor123 are formed by a common P type diffusion layer P2, it is possible tominiaturize the pixel circuit 110.

In addition, in this embodiment, the P type diffusion layer P2, the gatenode G1, and the connection wiring are provided at positionsintersecting with the center line Mid. In this manner, the gap betweenthe P type diffusion layer P2, the gate node G1, and the connectionwiring and the scanning lines 12 and the signal lines 143 is increased,whereby a parasitic capacitance on the capacitance therebetween can beprevented.

That is, the present embodiment, the influence of potential fluctuationsgenerated at the scanning lines 12 and the signal lines 143 on thepotential of the gate node g can be minimized, and it is possible tocontrol the current supplied to the OLED 130 with high precision.

In addition, according to the present embodiment, since the potentialrange ΔVgate in the gate node g is narrowed with respect to thepotential range ΔVdata of the data signal, even if the data signal isnot cut up with fine precision, it is possible to apply a voltagereflecting the gradation level between the gate and source of thetransistor 121. For this reason, even in a case where a small currentflowing through the OLED 130 with respect to changes of the voltage Vgsbetween the gate and the source of the transistor 121 in the fine pixelcircuit 110 is changed to a relatively large extent, it is possible tocontrol the current supplied to the OLED 130 with high precision.

In addition, between the data lines 14 shown by a broken line in FIG. 3and the gate node g in the pixel circuit 110 there is a parasiticcapacitance Cprs in practice. For this reason, if the potential changerange of the data line 14 is large, there is propagation to the gatenode g through the capacitance Cprs, whereby so-called cross-talk,non-uniformity, or the like is generated and the display quality isdeteriorated. The influence of the capacitance Cprs is remarkablyapparent when the pixel circuit 110 is miniaturized.

In contrast, in the present embodiment, since the potential change rangeof the data lines 14 is also narrowed with respect to the potentialrange ΔVdata of the data signal, it is possible to suppress theinfluence through the capacitance Cprs.

According to the present embodiment, since it is possible to preserve aperiod which is longer than the scanning period, for example, 2horizontal scanning periods, as the period in which the transistor 125is turned on, that is, the reset period of the OLED 130, it is possibleto sufficiently initialize the voltage held in the parasitic capacitanceof the OLED 130 in the light-emitting period.

In addition, according to the present embodiment, in the current Idssupplied to the OLED 130 by the transistor 121, the influence of thethreshold voltage is canceled out. For this reason, according to thepresent embodiment, even if the threshold voltage of the transistor 121varies for each pixel circuit 110, since the variations are compensatedand the current according to the gradation level is supplied to the OLED130, the generation of display non-uniformity adversely affecting theuniformity of the display screen is suppressed and, as a result, ahigh-quality display is possible.

Description will be given of this cancelling out with reference to FIG.14. As shown in this drawing, in order to control the small currentsupplied to the OLED 130, the transistor 121 operates in a weakinversion region (sub-threshold region).

In the drawing, A illustrates a transistor for which the thresholdvoltage |Vth| is large and B illustrates a transistor for which thethreshold voltage |Vth| is small, respectively. Here, in FIG. 14, thevoltage Vgs between the gate and the source is the difference betweenthe characteristic shown by the solid line and the potential Vel.Further, in FIG. 14, the current of the vertical scale is shown by alogarithm in which the direction from the source toward the drain is setas positive (up).

The gate node g in the compensation period becomes a potential(Vel−|Vth|) from the potential Vini. For this reason, for the transistorA in which the threshold voltage |Vth| is large, the operation pointmoves from S to Aa while, for the transistor B in which the thresholdvoltage |Vth| is small, the operation point moves from S to Ba.

Next, In a case where the potentials of the data signals to the pixelcircuits 110 to which the two transistors belong are the same, that is,in a case where the same gradation level is indicated, in the writingperiod, the potential shift amounts from the operation points Aa and Baare both the same k1·ΔV. For this reason, for transistor A, theoperation point moves from Aa to Ab, and for transistor B, the operationpoint moves from Ba to Bb; however, the currents at the operation pointsafter the potential shift are aligned at almost the same Ids for boththe transistors A and B.

Second Embodiment

In the first embodiment, a configuration is adopted in which datasignals are directly supplied by the demultiplexer 30 to the other endsof the storage capacitors 44 of each column, that is, to the nodes h.For this reason, in the scanning period of each row, since the period inwhich the data signals are supplied by the control circuit 5 is equal tothe writing period, the time constraints are large.

Next, description will be given of the second embodiment in which it ispossible to relax such time constraints. Here, in the following, inorder to avoid duplication of explanation, description will be givenwith a focus on the parts which are different to the first embodiment.

FIG. 15 is a view showing a configuration of an electro-optical device10 according to the second embodiment.

The points where the second embodiment shown in the drawing is differentto the first embodiment shown in FIG. 2 are mainly the points that astorage capacitor 41 and a transmission gate 42 are provided in eachcolumn of the level shift circuit 40.

In detail, the transmission gates 42 in each column are electricallyinterposed between the output ends of the transmission gate 34 and theother ends of the storage capacitor 44. That is, the input end of thetransmission gate 42 is connected to the output end of the transmissiongate 34, and the output end of the transmission gate 42 is connected tothe other end of the storage capacitor 44. For this reason, thetransmission gate 42 functions as a first switch.

Here, the transmission gates 42 of each column are turned on as a groupwhen the control signal Gcpl supplied from the control circuit 5 is theH level (when the control signal /Gcpl is the L level).

On the other hand, the transmission gate 34 in the demultiplexer 30functions as a second switch.

In addition, one end of the storage capacitors 41 in each column isconnected to the output end of transmission gate 34 (input end of thetransmission gate 42), and the other end of the storage capacitors 41 isgrounded in common at a fixed potential, for example, a potential Vss.Although omitted from FIG. 15, the capacitance of the storage capacitor41 is set as Crf2. Here, the potential Vss is equivalent to the L levelof the scanning signals or control signals, which are logic signals.

Operation of the Second Embodiment

Description will be given of the operation of the electro-optical device10 according to the second embodiment with reference to FIG. 16. FIG. 16is a timing chart for illustrating the operation of the secondembodiment.

As shown in the drawing, the point that the scanning signals Gwr(1) toGwr(m) are sequentially switched to the L level and, in the period ofone frame, 1 to m rows of scanning lines 12 are scanned in order foreach single horizontal scanning period (H), is the same as the firstembodiment. Further, in the second embodiment, the point that thescanning period of the i row follows the order of an initializationperiod shown by (b), a compensation period shown by (c), and a writingperiod shown by (d) is also the same as the first embodiment. Here, thewriting period of (d) in the second embodiment is a period from the timethe control signal Gcpl changes from the L to the H level (time when thecontrol signal /Gcpl has become the L level) to the time when thescanning signal changes from the L to the H level.

In the second embodiment, similarly to the first embodiment, regardingthe chronological order, a cycle of (light-emittingperiod)->initialization period->compensation period->writingperiod->(light-emitting period) is repeated. However, in the secondembodiment, in comparison with the first embodiment, the supply periodof the data signal is not equal to the writing period, and there is adifference in the point that the supply of the data signal precedes thewriting period. In detail, the point that, in the second embodiment, thedata signal can be supplied across the initialization period of (a) andthe compensation period of (b) is different from the first embodiment.

Light-Emitting Period

In the second embodiment, as shown in FIG. 16, the scanning signalGwr(i) in the light-emitting period of the i-th row is the H level, and,the control signal Gel(i) is the L level, and the control signalsGcmp(i) and Gorst(i) are the H level.

For this reason, in the pixel circuit 110 of i row (3j-2) column asshown in FIG. 17, since the transistor 124 is turned on while thetransistors 122, 123, and 125 are turned off, the operation of the pixelcircuit 110 is basically the same as the first embodiment. In otherwords, the transistor 121 supplies a current Ids according to thevoltage Vgs between the gate and the source to the OLED 130.

Initialization Period

Upon reaching the scanning period of the i-th row, first, theinitialization period of (b) is started.

In the initialization period in the second embodiment, in comparisonwith the light-emitting period, the control signal Gel(i) is changed tothe H level and the control signal Gorst(i) is changed to the L level,respectively.

For this reason, as shown in FIG. 18, in the pixel circuit 110 of the irow (3j-2) column, the transistor 124 is turned off and the transistor125 is turned on. In this manner, since the path of the current suppliedto the OLED 130 is interrupted and the anodes of the OLED 130 are resetto the potential Vorst by the turning on of the transistor 124, theoperation of the pixel circuit 110 is basically the same as the firstembodiment.

Meanwhile, in the initialization period in the second embodiment, thecontrol signal /Gini becomes the L level, the control signal Grefbecomes the H level, and the control signal Gcpl becomes the L level.For this reason, in the level shift circuit 40, the transistors 45 and43 are respectively turned on as shown in FIG. 18 and the transmissiongate 42 is turned off. Accordingly, the data line 14 which is one end ofthe storage capacitor 44 is initialized to the potential Vini and thenode h which is the other end of the storage capacitor 44 is initializedto the potential Vref, respectively.

The potential Vref in the second embodiment is set to a value such thatthe potential of the node h in the subsequent writing period can beincreased with respect to the potential which can be taken by the datasignals Vd(1) to Vd(n), similarly to the first embodiment.

As described above, the control circuit 5 in the second embodimentsupplies data signals across the initialization period and thecompensation period. That is, for a j numbered group, the controlcircuit 5 switches the data signals Vd(j) in order to a potentialaccording to the gradation level of pixels of the i row (3j-2) column,the i row (3j-1) column, and the i row (3j) column while setting thecontrol signals Sel(1), Sel(2), and Sel(3) in order exclusively to the Hlevel in accordance with the switching of the potential of the datasignal. In this manner, in the demultiplexer 30, the transmission gates34 in each group are turned on in order of the left end column, thecenter column, and the right end column, respectively.

Here, in the initialization period, in a case where the transmissiongate 34 of the left end side belonging to the j-numbered group is turnedon by the control signal Sel(1), as shown in FIG. 18, since the datasignal Vd(j) is supplied to one end of the storage capacitor 41, thedata signal is held by the storage capacitor 41.

Compensation Period

In the scanning period of the i-th row, the compensation period of (c)is next. In the compensation period in the second embodiment, incomparison with the initialization period, the scanning signal Gwr(i) ischanged to the L level and the control signal Gcmp(i) is changed to theL level, respectively.

For this reason, as shown in FIG. 19, the transistor 122 is turned on inthe pixel circuit 110 of the i row (3j-2) column) and the gate node g iselectrically connected to the data lines 14, while the transistor 121becomes a diode connection due to the turning on of the transistor 123.

Accordingly, since the current flows in the path of the power supplyline 116->transistor 121->transistor 123->transistor 122->data line 14of (3j-2)-th column, the gate node g is increased from the potentialVini and is eventually saturated at (Vel−|Vth|). Accordingly, even inthe second embodiment, the storage capacitor 132 holds the thresholdvoltage |Vth| of the transistor 121 until the end of the compensationperiod is reached.

In the second embodiment, since the control signal /Gini becomes the Hlevel in a state where the control signal Gref is maintained at the Hlevel in the compensation period, the node h in the level shift circuit40 is fixed at a potential Vref.

In addition, in the compensation period, in a case where thetransmission gate 34 of the left end side belonging to the j-numberedgroup is turned on by the control signal Sel(1), as shown in FIG. 19,the data signal Vd(j) is held by the storage capacitor 41.

Here, in the initialization period, in a case where the transmissiongate 34 of the left end column belonging to the j-numbered group arealready turned on by the control signal Sel(1), in the compensationperiod, the transmission gate 34 is not turned on; however, there is nochange in the point that the data signal Vd(j) is held by the storagecapacitor 41.

In addition, when the compensation period is finished, since the controlsignal Gcmp(i) is the H level, the diode connection of the transistor121 is canceled.

In the second embodiment, since the control signal Gref becomes the Llevel during the period from the end of the compensation period untilthe next writing period starts, the transistor 43 is turned off. Forthis reason, the path leading up to the gate node g in the pixel circuit110 of i row (3j-2) column from the data line 14 of the (3j-2)-th columnbecomes a floating state, but the potential in the path is maintained at(Vel−|Vth|) by the storage capacitors 50 and 132.

Writing Period

In the writing period in the second embodiment, the control signal Gcplbecomes the H level (control signal /Gcpl becomes the L level). For thisreason, as shown in FIG. 20, since the transmission gate 42 is turned onin the level shift circuit 40, the data signal held by the storagecapacitor 41 is supplied to the node h which is the other end of thestorage capacitor 44. For this reason, the node h shifts from thepotential Vref in the compensation period. In other words, the node h ischanged to the potential (Vref+ΔV).

Meanwhile, since the gate node g is connected to one end of the storagecapacitor 44 through the data lines 14, it has a value shifted upwardsfrom the potential (Vel−|Vth|) in the compensation period by a value inwhich the potential change amount ΔV of the node h is multiplied by thecapacitance ratio k2 only. In other words, the potential of the gatenode g becomes a value (Vel−|Vth|+k2·ΔV) shifted upwards from thepotential (Vel−|Vth|) in the compensation period by a value in which thepotential change amount ΔV of the node h is multiplied by thecapacitance ratio k2 only.

Here, in the second embodiment, the capacitance ratio k2 is thecapacitance ratio of Cdt, Crf1, and Crf2. As described above, thecapacitance Cpix of the storage capacitor 132 is ignored.

Further, at this time, the voltage Vgs of the transistor 121 becomes avalue (|Vth|−k2·ΔV) decreased by the amount which the potential of thegate node g shifts upward from the threshold voltage |Vth|.

Light-Emitting Period

In the second embodiment, after the writing period of the i-th row isfinished, the light-emitting period is reached during the singlehorizontal scanning period. In this light-emitting period, since thecontrol signal Gel(i) as described above becomes the L level, thetransistors 124 in the pixel circuits 110 of the i row (3j-2) columnsare turned on.

The voltage Vgs between the gate and the source is (|Vth|−k2·ΔV) and isa value level-shifted according to the potential of the data signal fromthe threshold voltage of the transistor 121. For this reason, as shownin the previous FIG. 17, the current according to the gradation level issupplied to the OLED 130 in a state where the threshold voltage of thetransistor 121 is compensated.

Such an operation is performed in parallel in terms of time in thescanning period of the i row and the also in the other pixel circuits110 of the i-th row other than the pixel circuits 110 of the (3j-2)-thcolumn. In addition, such an operation of the i-th row is in practiceperformed in the order of 1, 2, 3, . . . , (m-1), and m-th row in theperiod of one frame, and is repeated for each frame.

Effect of the Second Embodiment

According to the second embodiment, similarly to the first embodiment,even in a case where a small current flowing through the OLED 130 withrespect to changes of the voltage Vgs between the gate and the source ofthe transistor 121 in the fine pixel circuit 110 is changed to arelatively large extent, it is possible to control the current suppliedto the OLED 130 with high precision.

According to the second embodiment, similarly to the first embodiment,as well as being able to sufficiently initialize the voltage held by theparasitic capacitance of the OLED 130 in the light-emitting period, evenif the threshold voltage of the transistor 121 varies for each pixelcircuit 110, the generation of display non-uniformity adverselyaffecting the uniformity of the display screen is suppressed and, as aresult, a high-quality display is possible.

According to the second embodiment, an operation of holding the datasignal supplied through the demultiplexer 30 from the control circuit 5in the storage capacitor 41 is performed from the initialization periodto the compensation period. For this reason, it is possible to relax thetime constraints on the operations to be performed in one horizontalscanning period.

For example, since, as the voltage Vgs between the gate and the sourcein the compensation period approaches the threshold voltage, the currentflowing in the transistor 121 deteriorates, time is required to bringthe gate node g to the potential (Vel−|Vth|); however, in the secondembodiment, it is possible to preserve a long compensation period asshown in FIG. 16 in comparison with the first embodiment. For thisreason, according to the second embodiment, in comparison with the firstembodiment, it is possible to compensate the variations of the thresholdvoltage of the transistor 121 with high precision.

In addition, it is possible to slow down the supply operation of thedata signal.

Application and Modification Examples

The invention is not limited to embodiments such as the above-describedembodiments and application examples, and, for example, variousmodifications are possible as described in the following. Further, oneor a plurality of arbitrarily selected forms of the modificationsdescribed below can also be combined as appropriate.

Control Circuit

In the embodiment described above, the control circuit 5 supplying datasignals is set as separate to the electro-optical device 10; however,the control circuit 5 may also be integrated in the silicon substratewith the scanning line driving circuit 20, the demultiplexer 30 and thelevel shift circuit 40.

Demultiplexer

In the above-described embodiments and modification examples, aconfiguration is adopted in which the data lines 14 are grouped inthrees, the data lines 14 are selected in order in each group, and datasignals are supplied; however, the number of data lines configuring agroup may be 2 or may be 4 or more.

In addition, a configuration may be adopted in which the data signalsare supplied in line order together to the data lines 14 of each columnwithout grouping, that is, without using the demultiplexer 30.

Channel Type of Transistor

In the above-described embodiments and modification examples, thetransistors 121 to 125 in the pixel circuits 110 are standardized as Pchannel types; however, they may be standardized as N channel types.Further, the P channel types and N channel types may be appropriatelycombined.

Storage Capacitor

In the above-described embodiments and modification examples, thepotential of the gate node g and the data lines 14 is set through thestorage capacitor 44 by supplying the data signal Vd(j) to the other endof the storage capacitor 44; however, the invention is not limited tosuch a form, and the potential of the gate node g may be set bysupplying the data signal Vd(j) directly to the other end of the datalines 14. In such a case, the electro-optical device 10 need not beprovided with the storage capacitor 44 (or the storage capacitor 41).

Pixel Circuit

In the above-described embodiments and modification examples, the P typediffusion layer P2, the gate node G1, and the connection wiring arearranged such that the first gap Δy₁ and the second gap Δy₂ are equal;however, the invention is not limited to such a form, and the P typediffusion layer P2, the gate node G1, and the connection wiring may beprovided such that the value difference |Δy₁−Δy₂| between the first gapΔy₁ and the second gap Δy₂ becomes smaller than a predeterminedtolerance.

Even in a case where the first gap Δy₁ and the second gap Δy₂ aredifferent values, when the value difference |Δy₁−Δy₂| becomes smallerthan a predetermined tolerance, the P type diffusion layer P2, the gatenode G1, and the connection wiring are arranged at approximately equaldistances from the scanning lines 12 and the signal lines 143. That is,in this case, since it is possible to increase the gap between the Ptype diffusion layer P2, the gate node G1, and the connection wiring,and the scanning lines 12 and the signal lines 143, the influence ofpotential fluctuations generated at the scanning lines 12 and the signallines 143 on the potential of the gate node g can be minimized.

Other

In such embodiments, an OLED which is a light-emitting element has beenexemplified as an electro-optical element; however, for example, it maybe one emitting light at a luminance according to the current such as aninorganic light-emitting diode or an LED (Light Emitting Diode).

Electronic Apparatus

Next, description will be given of an electronic apparatus applying theelectro-optical device 10 according to such embodiments or applicationexamples. The electro-optical device 10 is for high-definition displayapplications with small pixels. Thus, description will be given taking ahead mounted display as an example of the electronic apparatus.

FIG. 21 is a diagram showing the external appearance of a head mounteddisplay and FIG. 22 is a diagram showing the optical configurationthereof.

First, as shown in FIG. 21, the head mounted display 300 includestemples 310, a bridge 320, and lenses 301L and 301LR, which are similarto normal glasses in terms of the external appearance. In addition, asshown in FIG. 22, in the head mounted display 300, at the far side(bottom side in the drawing) of the lenses 301L and 301R which are inthe vicinity of the bridge 320, an electro-optical device 10L for lefteye use and an electro-optical device 10R for right eye use areprovided.

The image display surface of the electro-optical device 10L is arrangedto be on the left side in FIG. 22. In this manner, the display imageaccording to the electro-optical device 10L is emitted in the directionof 9 o'clock in the drawing through the optical lens 302L. A half mirror303L reflects the display image according to the electro-optical device10L in the 6 o'clock direction while allowing light incident from the 12o'clock direction to pass therethrough.

The image display surface of the electro-optical device 10R is arrangedso as to be on the right side opposite to the electro-optical device10L. In this manner, the display image according to the electro-opticaldevice 10R is emitted in the direction of 3 o'clock in the drawingthrough the optical lens 302R. A half mirror 303R reflects the displayimage according to the electro-optical device 10R in the 6 o'clockdirection while allowing light incident from the 12 o'clock direction topass therethrough.

In this configuration, the wearer of the head mounted display 300 canobserve the display image according to the electro-optical devices 10Land 10R in a see-through state superimposed with the outside view.

Further, in the head mounted display 300, with parallax images for botheyes, when an image for the left eye is displayed on the electro-opticaldevice 10L and an image for the right eye is displayed on theelectro-optical device 10R, the wearer can be made to perceive thedisplayed image as though it had a sense of depth or a stereoscopiceffect (3D display).

Here, in addition to the head mounted display 300, the electro-opticaldevice 10 can also be applied to an electronic viewfinder of a videocamera, a digital camera with interchangeable lenses, or the like.

The entire disclosure of Japanese Patent Application No. 2011-249815,filed Nov. 15, 2011 is expressly incorporated by reference herein.

What is claimed is:
 1. An electro-optical device comprising: a powersupply line; a light emitting element; a relay electrode; a firsttransistor controlling an electrical connection between the power supplyline and the light emitting element, the first transistor having a gateelectrode; a first insulating layer having a contact hole, the firstinsulating layer being provided between the gate electrode and the relayelectrode; a second insulating layer provided on the relay electrode;and an electrode provided on the second insulating layer, the electrodebeing electrically connected to the power supply line, wherein the relayelectrode is electrically connected to the gate electrode through thecontact hole, and wherein a storage capacitor is formed by interposingthe second insulating layer between the relay electrode and theelectrode.
 2. The electro-optical device according to claim 1, furthercomprising a second transistor through which the first gate of the firsttransistor is electrically connected to a data line while the secondtransistor is in an on-state, the second transistor having a secondgate, a second drain, and a second source; and a third transistorthrough which the first gate of the first transistor is electricallyconnected to the first drain of the first transistor while the thirdtransistor is in an on-state, the third transistor having a third gate,a third drain, and a third source.
 3. The electro-optical deviceaccording to claim 2, wherein one of the second source and the seconddrain of the second transistor and one of the third source and the thirddrain of the third transistor are formed by a common diffusion layer. 4.The electro-optical device according to claim 1, further comprising afourth transistor electrically connected between a potential line towhich a predetermined potential is supplied and the light-emittingelement.
 5. The electro-optical device according to claim 1, furthercomprising a fifth transistor electrically connected between the firsttransistor and the light-emitting element.
 6. An electronic apparatuscomprising the electro-optical device according to claim
 1. 7. Anelectronic apparatus comprising the electro-optical device according toclaim
 2. 8. An electronic apparatus comprising the electro-opticaldevice according to claim
 3. 9. An electronic apparatus comprising theelectro-optical device according to claim
 4. 10. An electronic apparatuscomprising the electro-optical device according to claim 5.